Lead frames are critical components in electronic packaging, providing the conductive pathways between the semiconductor device and external circuits. These frames are essential for the proper functioning of devices such as integrated circuits and transistors.

Photo Etching Process for Lead Frames

At TONGJIN Technology, we utilize photo etching to manufacture lead frames with extreme precision. Unlike traditional stamping, photo etching avoids creating burrs and stress points, ensuring a higher quality product. Our process allows for the production of complex designs that are not achievable with conventional techniques.

Benefits of Etched Lead Frames

• Stress-Free Components: Our etching process eliminates mechanical stress, resulting in more reliable components.
• Miniaturization: The precision of photo etching allows for the creation of extremely small and intricate designs.
• Cost-Effective: The absence of costly tooling reduces production costs and accelerates lead times.

Post-Process Options

We offer a variety of post-process treatments and finishes to meet your specific requirements, including plating, coating, and surface treatment for enhanced performance and durability.

Applications in Electronics

Our etched lead frames are widely used in semiconductor devices, including integrated circuits, transistors, and diodes. The precision and customization options make them ideal for advanced electronics where accuracy and reliability are paramount.

Why Choose TONGJIN Technology?

With years of experience and a commitment to cutting-edge technology, TONGJIN Technology is a leader in the manufacturing of high-precision etched lead frames. We provide exceptional service, ensuring that every project meets the highest quality standards.